Lithography continues to play a central role in device scaling, and ArF immersion extension and multiple patterning will be crucial as the industry transitions to the 7 nm node. A record number of guests attended the 13th annual LithoVision symposium held earlier this year, where experts from Micron Technology, Toshiba, Intel Corporation, CEA-Leti, KLA-Tencor, and Nikon shared valuable insight on the foremost challenges and opportunities for further industry scaling.
The LithoVision presentations emphasized critical topics such as edge placement error reduction, the necessity of an integrated approach between lithography and dry etch, the capabilities and potential cost benefits for contact multiplication with DSA/193i lithography, as well as the need for computational methods for CD and overlay metrology in next-generation litho. The agenda featured discussion of key memory industry dynamics, and provided a view of lithography in the 3D memory era as well. Nikon also shared information about the latest generation NSR-S631E immersion scanner and advanced thermal control capabilities that ensure optimal on-product performance for 7 nm manufacturing and beyond. This edition of the Nikon eReview includes highlights of many of the LithoVision presentations, and full event materials are available to customers upon request.
While the industry-leading S631E immersion scanner satisfies 7 nm requirements, Nikon also continues to expand our exposure system portfolio to support a variety of other markets/applications. We are leveraging decades of lithography equipment experience to deliver specially developed low numerical aperture steppers to be used in manufacturing of MEMS, LEDs, TSVs, and more.
Nikon values your input on how we can continue to improve our products, programs, and services, and we encourage you to respond to the Nikon eReview at email@example.com with your thoughts and comments.