There is no shortage of technical challenges at future nodes, and experts from across the lithography supply chain discussed their views and possible solutions at the LithoVision symposium earlier this year. The latter part of the symposium included industry specialists Kevin Lucas (Synopsys), Mark Smith (KLA-Tencor), Ralph Dammel (EMD Performance Materials), and Steve Renwick (Nikon Research).
The SPIE Advanced Lithography conference featured many presentations focusing on the complexity and cost of advancing lithography. In case you weren’t able to attend this year’s conference, excerpts from various media channels are reported here.
Janice Golda of Intel Corporation discussed the key semiconductor industry drivers, and Ryoichi Kawaguchi detailed lithography industry requirements and the Nikon Roadmap at LithoVision.
Micron Technology Director Erik Byers shared his insight on Memory scaling trends, emerging technologies, 3D integration, and associated lithography challenges at the LithoVision symposium.
Dr. Harry Levinson of GLOBALFOUNDRIES provided an in-depth view of the Status of Lithography including challenges and viability for immersion extension, DSA, and EUV at the 7 nm node.
Nikon experts spotlight comprehensive solutions that ensure optimal overlay and focus performance under the complex process conditions typical of high volume manufacturing at 10 nm and beyond.
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Nearly 550 attendees joined Nikon for the 12th annual LithoVision technical symposium focused on “193i Extension to 7 nm and Beyond…” Representatives of more than 120 international companies throughout the industry attended this year’s event to learn about the leading semiconductor lithography drivers, challenges, and solutions.