Past Edition – Spring 2016

Scaling to the 7 nm node and beyond with multiple patterning is reliant upon reducing overlay and increasing throughput in manufacturing. These require advanced thermal control capabilities. Nikon hardware and software solutions ensure optimal on-product performance and productivity using real-world exposure conditions.

At LithoVision, Dr. Jérôme Hazart, Computational Litho Group Technical Manager, discussed CEA-Leti’s work with DSA block copolymers for via layers. He highlighted the compatibility and potential cost benefits for contact multiplication with DSA/193 nm immersion lithography.

Kohji Hashimoto, Advanced Memory Development Center Director for Toshiba Storage & Electronic Devices Solutions Company, shared critical insight on “Lithography in the 3D Memory Era,” at the Nikon symposium. His presentation stressed that a new relationship between lithography and dry etch is imperative.

At LithoVision 2016, Dr. Mark Phillips, Intel Fellow and Director of Lithography Hardware and Solutions, provided an in-depth “Chipmaker View of Lithography for the Next Node,” emphasizing edge placement error reduction. Complementary Nikon presentations detailed on-product performance challenges and NSR-S631E innovations.

Nikon hosted a record-setting audience of over 600 guests at this year’s LithoVision technical symposium, which focused on “Design, Manufacturing, and Litho at the Next Node.” Representatives from across the worldwide semiconductor industry attended this year’s event to learn about the foremost challenges and solutions for continued device scaling.

Every year, Nikon Precision Inc. and Nikon Research Corporation of America support SEMI High Tech U, a STEM-based career exploration program for high school students. This program is hosted by the SEMI Foundation, which organizes educational and career activities for students to raise interest in engineering and other high-tech fields.

Nikon truly believes that practicing good corporate citizenship supports our company vision. We are proud to be active partners in the communities in which we live, work and serve to help support health and welfare, educational, environmental, cultural and civic needs.

Specially developed low numerical aperture steppers accommodate a range of substrate sizes and materials, provide backside alignment capabilities, and satisfy unique resolution and depth of focus requirements for many diverse markets.

At the annual Nikon conference,
Dr. Mike Adel, Senior Director of Applications at KLA-Tencor, addressed the need for computational methods for CD and overlay metrology in next-generation lithography. He also described ways computational litho will be used in optimizing overlay target design and placement.

Dr. Naga Chandrasekaran, VP of Process Research and Development at Micron Technology, gave an exceptional keynote speech addressing the “Memory Business and Technology Perspective.” This presentation provided an expert view on memory industry dynamics as well as the importance of lithography in DRAM and V-NAND scaling.

EIPBN 2016 Pittsburgh, PA May 31-June 3, 2016 SEMICON West 2016 Booth 1705 San Francisco, California July 12-14, 2016