IC Knowledge LLC President, Scotten Jones, updated LithoVision guests on the “Evolving Semiconductor Technology Landscape, and What it Means for Lithography,” and provided key insight on NAND, DRAM and logic device trends.
Nikon has been aggressively developing new technologies targeting scanner and process-related OPO error factors. Earlier this year, Nikon technologists introduced many innovations of the industry-leading NSR-S635E immersion scanner, and the iAS and LithoBooster alignment stations.
At the 15th annual Nikon conference, Dr. Martin Weiss, Principal Engineer with Intel’s Portland Technology Development group, highlighted the importance of overlay and underlay control in continuing 193i scaling.
At the recent LithoVision technical symposium Aaron Bowser, Senior Lithography Manager at Seagate Technology, shared valuable insights into the unique challenges and innovations in lithography for leading-edge hard disk drives.
Dr. Uday Mitra, VP and CTO for the Etch Business Unit and Patterning Module at Applied Materials, discussed materials enabled solutions for EPE and logic scaling at the Nikon symposium.
As a superior alternative to mask aligners and outdated wafer steppers, Nikon continues to focus on expanding their specialized product portfolio to meet customers’ particular performance and budgetary objectives.
Plan now to visit Nikon Precision at SEMICON West booth 505 in South Hall. We invite you to learn about our cutting-edge lithography products and programs.
Dr. Stephen Renwick of Nikon Research Corporation of America will share insight on multiple patterning strategies at the upcoming session in Sun Valley, Idaho.
To meet the dynamic requirements of our broad customer base, Nikon continuously innovates through optimizing internal training and operations, and by developing specialized customer support programs to satisfy individual fab objectives.