Kohji Hashimoto, Advanced Memory Development Center Director for Toshiba Storage & Electronic Devices Solutions Company, shared critical insight on “Lithography in the 3D Memory Era,” at the Nikon symposium. His presentation stressed that a new relationship between lithography and dry etch is imperative.
At LithoVision 2016, Dr. Mark Phillips, Intel Fellow and Director of Lithography Hardware and Solutions, provided an in-depth “Chipmaker View of Lithography for the Next Node,” emphasizing edge placement error reduction. Complementary Nikon presentations detailed on-product performance challenges and NSR-S631E innovations.
At LithoVision, Dr. Jérôme Hazart, Computational Litho Group Technical Manager, discussed CEA-Leti’s work with DSA block copolymers for via layers. He highlighted the compatibility and potential cost benefits for contact multiplication with DSA/193 nm immersion lithography.
At the annual Nikon conference,
Dr. Mike Adel, Senior Director of Applications at KLA-Tencor, addressed the need for computational methods for CD and overlay metrology in next-generation lithography. He also described ways computational litho will be used in optimizing overlay target design and placement.
Specially developed low numerical aperture steppers accommodate a range of substrate sizes and materials, provide backside alignment capabilities, and satisfy unique resolution and depth of focus requirements for many diverse markets.