Nikon hosted a record-setting audience of over 600 guests at this year’s LithoVision technical symposium, which focused on "Design, Manufacturing, and Litho at the Next Node.” Feedback from event attendees indicated that this year’s technical session was perhaps the best yet! Deemed by some guests a “Good mix of forecast, products, and challenges…,” and “The best Sunday working in a long time…,” representatives of more than 130 companies from across the worldwide semiconductor industry attended this year’s event to learn about the foremost challenges and solutions for continued device scaling.
Figure 1A. Nikon hosted more than 600 global representatives of the semiconductor industry at the 2016 LithoVision symposium held at the City National Civic in San Jose, California (left image). Figure 1B. Toshikazu Umatate, Senior Vice President of Nikon Corporation and General Manager of the Nikon Semiconductor Lithography Business Unit, delivered the closing remarks at LithoVision 2016.
Returning to the City National Civic, the 2016 event featured an exceptional keynote address by Naga Chandrasekaran, Ph.D., of Micron Technology, as well as informative presentations by distinguished representatives from Toshiba, Intel, KLA-Tencor, CEA-Leti and Nikon. The esteemed presenters examined topics including Litho Drivers/Requirements, Enabling Production beyond 10 nm, and Next Node Perspectives that reflected expert viewpoints across our industry. The evening was capped with a poster session and an enjoyable reception in the lobby of the City National Civic.
LithoVision is consistently lauded for the great technical content and prestigious presenter line-up, and this year’s event certainly did not disappoint!
Highlights of a number of the LithoVision presentations are featured in this edition of the Nikon eReview, and full event materials are available to customers upon request. If your company is interested in presenting at LithoVision 2017 or you have a suggestion regarding future events, please email us at lithovision@nikon.com.