The SPIE Advanced Lithography conference is globally recognized as the preeminent event providing up-to-the minute information about critical lithography issues and advancements. The 2015 event delivered on those expectations with many presentations focusing on the complexity and cost of advancing lithography. In case you weren’t able to attend the conference or were unable to attend all of the numerous technical sessions offered, we’ve compiled an overview of key topics around the annual lithography convention as reported through various media channels.
The jam-packed SPIE week got underway with a number of expert updates at the 2015 LithoVision event on Sunday. Dan Hutcheson of VLSIresearch discussed the LithoVision presentations in the March 6 edition of The Chip Insider®, and excerpts of his comments are included below.
LithoVision was followed by in-depth SPIE technical presentations that continued through late in the day on Thursday. Complexity, cost issues, and EUV challenges featured heavily throughout SPIE and surrounding media. Selections from various outlets are included below.
SPIE Advanced Lithography continues to be a highlight of our industry, and many advancements as well as opportunities for the future were revealed at the 2015 conference. It was evident that litho complexity and cost will be increasingly challenging, making industry collaboration and innovation imperative to achieving next-generation manufacturing objectives.